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is used for connect assembly of bare integrated circuits
on glass substrate directly by using Anisotropic Conductive Film .
The pitch of the IC bumps can be scaled down according to customers'
requirements . This method reduces the assembly area to the highest
possible packing density, which especially import ant to those
applications that space saving is crucial. It allows a
cost-effective mounting of driver chips because integrating
flex PCB is no longer required. The IC is bonded directly onto
the glass substrate and is suitable for handling high-speed or high-frequency signals.
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