|
Company Information Information
|
||||||||||||||||||||||||||||||||||||
| Depending on the power load and power dissipation, copper levels of inner layers at thickness of 105 micron, 210 micron,400 micron or 700 micron Copper thickness of outer layers variable from 50 micron up to 1050 micron Up to 8 x 400 μm copper possible within a single PCB Many years of mass production experience in 400 micron copper on inner layers 4 x 400 micron copper at performance levels 4 x 70 micron copper at logic levels .hemeixinpcb |
Click the picture to view original image
