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Company Information Information
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| Advanced thermal management and embedded coin technology High Performance and Emerging Materials; Halogen free,low loss,ultra-thin,mixed packages, inlay Sequential Lamination High Tech Drilling Capability – Small hole drilling, Backdrilling Mechanical depth control drilling with +/-10um tolerance,min drill size 0.15mm Ultra Fine Pitch (0.8, 0.5, 0.4, 0.3 mm) .hemeixinpcb |
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