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Company Information Information
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| 20 sets UV/YAG and over 160 CO2 laser heads ELIC (Every Layer Interconnection) Skipped, telescopic, stacked μvias 30 layers Min. microvia - 80μm Soldermask Registration: 25μm using direct imaging 50 um dielectric using 106 prepreg and 40 um core handling available RoHS compliance Lead free & Halogen free .hemeixinpcb |
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